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> New disco diamond wafer dicing blade/saw/wheel nbc-zh
New disco diamond wafer dicing blade/saw/wheel nbc-zh
NEW Disco Diamond Wafer Dicing Blade/Saw/Wheel NBC-ZH
The NBC-ZH series is produced using DISCO's original technology. A combination of an ultra-thin diamond blade and an aluminum hub provides enhanced operation efficiency and stable cutting results. In combination with DISCO's vast application knowledge, these blades provide excellent cutting results when dicing silicon wafers and compound semiconductor wafers such as GaAs.
Silicon, GaAS, GaP, LiTaO3, etc.
6000 Series and 600 Series fully automatic dicing saws
3000 Series, 300 Series, and 500 Series automatic dicing saws
